Core Technology
12 Key Technologies
Key technologies of high-power, high-efficiency, high-brightness, and high-reliability chips
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Packaging Technologies
NVS Eutectic
HBF Fiber Coupling
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Chip Fabrication Technologies
G3 Technology
IFVD Technology
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Wafer Growth
SIC Technology
PQA Technology
LDHSC Technology
DS Technology
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Chip Design
NC High Quantum Efficiency
SALOC Low Loss
SP Small Divergence
NA-Suppressed COD
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- Packaging Technologies
- Chip Fabrication Technologies
- Wafer Growth
- Chip Design
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Technical Articles
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Epitaxial Material Growth Technology
- Low loss and low impurity process technology.
- Low defect density control technology.
- High uniformity and repeated stability.
- High stress compensated quantum well growth technology.
- Interface control technology for hybrid material systems.
High Efficiency Chip Design
NC High Quantum Efficiency
By taking new energy band design of carrier confinement, current injection efficiency is increased, carrier leakage effect under high current is greatly decreased, improvement and breakthrough is made for quantum efficiency.
SALOC Low Loss
We developed a new waveguide structure with light field and doping distribution, made breakthrough of mutual constraints between internal loss and voltage, achieved low voltage as well as extremely low internal loss.
