DoGain Honored with CFCF2026 Annual Innovative Product Award
Breakthrough Chip Innovation: Core Solution for Wide-Temperature & Miniaturization
The award-winning single-mode 980 nm uncooled semiconductor laser chip and ultra-compact 3PIN module serve as the core pump source for optical signal amplifiers. Adopting 3PIN uncooled ultra-miniature module packaging technology, this product breaks through the bottleneck of high-temperature performance under uncooled operation. It enables stable operation of the single-mode chip across a wide temperature range of 0 to 85°C, with the fiber-coupled module delivering a reliable output power exceeding 300 mW.
It integrates multiple advantages including compact size, low power consumption, wavelength locking covering full current and full temperature dynamic ranges, high output power, superior thermal performance and broad spectrum. Having passed stringent Telcordia reliability certification, the product supports long-term operation in uncooled environments. It is widely applicable to miniaturized EDFAs, AI data communications, coherent optical modules, intelligent optical sensing and other scenarios.
Five Core Technological Innovations
1. High-Temperature Low-Loss Epitaxial Structure Design Technology
To address carrier leakage and intensified non-radiative recombination under high temperatures, the structure of quantum well depth, barrier height and waveguide layer is optimized to strengthen carrier confinement and boost internal quantum efficiency.
2. Collaborative Design Technology of High-Power Single-Mode Waveguide and Longitudinal Structure
A design combining narrow-ridge single-mode waveguide and graded longitudinal structure is adopted. While maintaining fundamental transverse mode confinement, it optimizes current spreading and optical field distribution, striking a balance between transverse mode stability and uniform current injection under high output power.
3. Low-Defect & High-Uniformity Epitaxial Growth Control Technology
Precise regulation of growth temperature, V/III ratio and interface transition reduces material defect density and impurity incorporation, improving material uniformity and device consistency. It effectively mitigates efficiency degradation and stabilizes service lifetime under high-temperature and high-power operating conditions.
4. High-Reliability Facet Passivation Technology
5. High-Reliability Packaging and Fiber Coupling Technology
Full Chip Spectrum Expansion: Diverse Solutions Covering All Wavebands
DoGain has established a full-waveband single-mode laser product portfolio spanning 808–1550 nm, covering self-developed single-mode semiconductor laser chips and modules with DFB wavelength locking and FP non-wavelength locking technologies.
The company’s self-developed 1064 nm single-mode DFB chips and ultra-compact modules feature narrow linewidth, low noise and outstanding spectral stability. Serving as high-performance seed light sources for ultrafast laser systems, they are widely applied in cutting-edge sectors including quantum computing, quantum precision metrology and laser gyroscopes.
Customized SM/PM fiber output is available for all products, supporting both continuous-wave and pulsed operation modes. The lineup caters to diverse high-end applications such as fiber optical communications, optical sensing, ultrafast seed sources, laser medical treatment and quantum research.
Jointly Forge New Chip Paths: Decoding Development Trends of Optical Communication Chips in the AI Era
At the conference, Dr. Tang Song from DoGain delivered an invited keynote speech titled Optical Communication Series Chips and Their Progress for AI Interconnection Demands.
Against the backdrop of surging AI computing power, the speech focused on core requirements for underlying optical chips supporting optical interconnection. It systematically presented the industrialization achievements of DoGain’s proprietary technologies, elaborated on the company’s product layout and latest advances in optical communication chips, and detailed technical specifications, reliability performance, production capacity planning and customer applications of DoGain’s 70 mW–400 mW CW DFB chips and 100G PAM4 EML chips.
The presentation won high recognition and widespread praise from industry experts and industrial chain partners on site.
Winning the CFCF2026 Annual Innovative Product Award is high recognition of the superior performance and innovative value of DoGain’s single-mode 980 nm uncooled semiconductor laser chip and ultra-compact 3PIN module. It fully demonstrates DoGain’s cutting-edge technical prowess and product innovation capabilities in optoelectronic chips and optical modules, as well as full affirmation of the company’s technical iteration and mass production capacity.
As an enterprise with core competitiveness centered on the design and manufacturing of high-end laser chips, DoGain consistently adheres to a technology-led and innovation-driven strategy. It tackles core technical challenges, develops high-quality, high-performance and highly reliable core optoelectronic products, and continuously empowers the development of frontier industries including optical communications, AI computing power and quantum computing.
