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Aluminum Nitride (AlN) Submount（For TO）
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Aluminum Nitride (AlN) Submount（For TO）
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Aluminum Nitride (AlN) Submount（For TO）

Aluminum Nitride (AlN) Submount（For TO）

Thin film process
The thermal conductivity of the substrate ≥ 200W/m*K
Double-sided prefabricated gold and tin solder
Medium and low power packaging applications
Accept customized needs

Technical Specifications

Product Model Specification size Substrate thermal conductivity Gold and tin solder components Detailed Indicators
DG-AlN-200-TM-AuSn-1112-A1 1.10*1.20*0.26 mm ≥200W/m*K Au:75±5wt%

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