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Aluminum Nitride (AlN) Submount

Aluminum Nitride (AlN) Submount

Aluminum nitride thermal precipitation
Prefabricated gold and tin solder
The thermal conductivity of AIN ceramic substrate ≥ 200W/m*K
CTE matching chip material
High voltage resistance 1000V
Accept customized needs

Technical Specifications

Product Model Specification size Substrate thermal conductivity Gold and tin solder components Detailed Indicators
DG-AlN-200-TF-AuSn-4557-02 4.50*5.75*0.49 mm ≥200W/m*K Au:75±5wt%
DG-AlN-200-TF-AuSn-4048-22 4.05*4.80*0.49 mm ≥200W/m*K Au:75±5wt%
DG-AlN-200-TF-AuSn-4057-43 4.05*5.75*0.49mm ≥200W/m*K Au:75±5wt%
DG-AlN-200-TF-AuSn-3548-52 3.50*4.80*0.49mm ≥200W/m*K Au:75±5wt%
DG-AlN-200-TF-AuSn-4545-62 4.50*4.50*0.49mm ≥200W/m*K Au:75±5wt%
DG-AlN-200-TF-AuSn-4550-92 4.50*5.00*0.49mm ≥200W/m*K Au:75±5wt%
DG-AlN-230-TF-AuSn-4557-06 4.50*5.75*0.49mm ≥230W/m*K Au:75±5wt%
DG-AlN-230-TF-AuSn-5070-16 5.00*7.00*0.49mm ≥230W/m*K Au:75±5wt%
DG-AlN-230-TF-AuSn-4057-46 4.05*5.75*0.49mm ≥230W/m*K Au:75±5wt%
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