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DPC Thick Film Ceramic Substrate

DPC Thick Film Ceramic Substrate

Copper thickness 30~100μm, TTV≤ 10μm
The alignment accuracy of the A/B plane graph ≤± 20μm
The copper surface roughness Ra≤0.1μm
It can do electroplating process
Support round and square film customization

Technical Specifications

Product Model Specification size Substrate thickness A/B side copper thickness Detailed Indicators
DPC01 114.3*114.3*0.48 mm 330±10μm 75±10μm

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