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2026.05.20

DoGain Debuts at International Exhibition with Four Breakthrough Technologies


On January 22, 2026, the SPIE Photonics West Exhibition 2026 in the United States concluded at the Moscone Center in San Francisco. DoGain showcased multiple latest series products at Booth 2231, gathering with experts, scholars, industry peers, and clients from the global optoelectronics field to explore cutting-edge technological trends and demonstrate China’s 'core' strength.

 

 

At this exhibition, DoGain showcased a series of innovative products, covering core items such as high-power semiconductor laser chips, single-mode/multi-mode fiber-coupled modules, semiconductor laser stack modules, and VCSEL modules. These products span various applications including industrial processing, optical communications, intelligent sensing, and healthcare. The exhibition attracted many international experts and key customers who engaged in discussions on-site, demonstrating the innovative strength of Chinese laser technology to the global market and receiving widespread attention and high recognition.

 

During the exhibition, DoGain presented two major reports at the SPIE forum: 'High-efficiency High-power on-chip Wavelength-stabilized Laser Diodes and Modules' and 'Power Scaling of Broad-area Laser Diodes at 940nm'. The company showcased systematic breakthroughs in high power, high efficiency, high temperature performance, high reliability, and wavelength stability, and announced four key new technological breakthroughs, covering 976nm DFB multimode chips and modules, 1064nm DFB single-mode chips and modules, 940nm high-temperature resistant chips, and 2000W dual-junction bars. These technologies can be widely applied in cutting-edge fields such as fiber laser pumping, LiDAR, industrial processing, and nuclear fusion drivers.

 

 

976nm DFB Multimode Chip and Module — The Perfect Combination of High Power and Wavelength LockingThe chip adopts an on-chip distributed feedback grating design, and the 230μm wide chip achieves 38.2W output power under CW and 25°C conditions, with a maximum photoelectric conversion efficiency of more than 70% and a wavelength temperature drift coefficient of only 0.06 nm/°C. The fiber optic coupling module developed based on this has an output power of ≥ 650 W, which realizes full power wavelength lock in the range of 0–50°C, and is suitable for high-efficiency and high-stability fiber laser pumping.

1064nm DFB single-mode chip and module - narrow linewidth, high purity spectral output 
For ultrafast lasers and precision systems, the single-mode chip achieves 700mW kink-free output with a maximum electro-optical conversion efficiency of 55%. Its butterfly package module has an output power of more than 500mW, a maximum electro-optical conversion efficiency of 40%, and a wavelength that changes very little with current, showing stable narrow linewidth emission characteristics in long-term CW operation.

940nm high-temperature resistant single-tube chip – a high-reliability design for harsh environments
The chip can still achieve a power output of 11.4W under the condition of 105°C high temperature and 14A current, showing excellent high-temperature operation stability, and is suitable for high-temperature and high-reliability application scenarios such as automotive lidar.

Double-junction 2000W bar chip - a vertical structure innovation that breaks through the power limit
Adopting a double-junction epitaxy and tunnel junction design, the 2mm bar bar achieves an output power of more than 2000W driven by QCW (300μs, 10Hz) and 1000A current, which is about 1.72 times higher than that of a single-junction structure, providing a feasible pumping solution for extreme power requirements such as inertial confinement fusion.

As an IDM optoelectronic company with high-end laser chip design and manufacturing as its core competency, the company will always adhere to innovation-driven and technology-led principles, continuously launch more innovative products and technologies, deepen international industry cooperation, expand its limitless footprint, and provide global customers with higher-quality products and services.


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